Thin Wafer Market: Global Market Analysis and Future Assessment by Wafer Size, Technology, and Application — 2019-2029

Categories: Electronics, IT & Telecommunication | Report Code : IT20 | No. of Pages : 129

Overview:

The global thin wafer market is valued for more than US$ XXX.X Mn in 2019 and expected to reach a value of US$ XXX.X Mn by 2029 with a significant CAGR of around XX.X% over the forecast period of 2019-2029. Thin slice of semiconductor wafers used in fabrication of integrated circuits is called as thin wafers. These are also used in manufacturing of solar cells where it serves as a substrate for microelectronic products.

Market Dynamics:

Rising adoption of micro-electromechanical systems for various applications among various industries including healthcare, consumer electronics, and automotive is a key factor driving growth of the global thin wafer market. Rising deployment of advanced technologies in automotive sector such as continuous connectivity, advanced displays and features in vehicles is driving thin wafers deployment in the automotive sector for power semiconductors ICs.

In addition, growing demand for IoT devices and increasing adoption of connected devices are other factors fueling growth of the global market. However, lack of efficiency and durability of thin wafer in long range applications under high stress is a major factor hampering growth of the global thin wafer market to a certain extent. Rising focus on development of wafer support system to eliminate this issue is expected to offer lucrative opportunities for the key players in the market.

Key Trends:

Growing focus on merger and acquisitions among major players in order to enhance the product portfolio is a key trend observed in the global market. For instance, in July 2019, Applied Materials Inc. announced that the process of acquisition of Kokusai Electric Corporation. The acquisition is expected to aid in growth of Applied Materials Inc. by enhancing its existing single wafer processing systems.

Regional Analysis:

For detailed understanding of market dynamics, the global thin wafer market is analyzed across key regions viz. North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. Asia Pacific market is accounted for highest revenue share in 2019 and is expected to maintain its dominance over the forecast period. This is attributed to presence of key manufacturers coupled with presence of major consumer electronics companies in countries in the region. The market in North America is expected to witness significant growth in the global market, followed by the market in Europe over the forecast period.

Scope of the Report:

Report Feature

Details

Base Year:

2018

Projection Period:

2019-2029

Market Details:

Total revenue and forecast, CAGR, Market value, share, and Y-o-Y growth by segment and region

Segment Covered:

Wafer Size, Technology, and Application

Region Covered:

North America, Europe, Asia Pacific, Latin America, and Middle East & Africa

Report Coverage:

Market growth driving factors, challenges & pitfalls, opportunities, trends, key players analysis, and region analysis

 

Detailed Segmentation:

Global Thin Wafer Market, By Wafer Size:

  • 125 mm
  • 200 mm
  • 300 mm

Global Thin Wafer Market, By Technology:

  • Grinding
  • Polishing
  • Dicing

Global Thin Wafer Market, By Application:

  • CMOS Image Sensors
  • MEMS
  • Power Devices
  • Memory and Logic
  • RF Devices (GaAs)
  • Advanced Packaging (Interposers/3D TSV)

Key Players Covered:

Key players operating in the global thin wafer market includes LG Siltronic, Inc., Shin-Etsu Chemical Co., Ltd., Nissan Chemical Corporation, SUMCO Corporation, SunEdison Semiconductor Limited, SÜSS MicroTec AG, LINTEC Corporation, Disco Corporation, 3M Company, and Applied Materials, Inc.

Key Features of the Study:

Foresight Market Research provides detailed analysis on global market in our report- Global Thin Wafer Market by wafer size, technology, application, and region. The report provides market size (US$ Mn) and compounded annual growth rate (%) for the forecast period: 2019 – 2029, considering 2018 as the actual year. The report also contains in-depth analysis about market drivers, restraints, opportunities, new product launches, product approval, ongoing trends, and regional outlook. The report delivers competitive analysis about leading players in the global thin wafer market based on various parameters such as company overview, product portfolio, regional presence, financial performance, distribution strategies, key developments, marketing strategies, and future plans. The analysis from the report would acquaint the marketers and management authorities of companies to make the appropriate decision with respect to their future product launch, market expansion, and marketing tactics used overall the globe.

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Report Code

IT20

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